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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 1/7
HLM358P / HLM358S
LOW POWER DUAL OPERATIONAL AMPLIFIERS
Description
These devices consist of two independent, high gain, internally frequencycompensated operational amplifiers designed operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is 3V to 32V, and Vcc is at least 1.5V more positive than the input common-mode voltage, The low supply-current drain is independent of the magnitude of the power supply voltage.
8-Lead Plastic DIP-8 Package Code: P *
8-Lead Plastic SO-8 Package Code: S
Features
* Two internally compensated OP amps * Internally frequency compensated for unity gain * Short Circuit Protected Outputs * Wide power supply range: 3VDC to 32VDC (Single supply) * Input common-mode voltage range includes ground * Large output voltage swing: 0VDC to Vcc-1.5VDC
Logic Diagram (each amplifier)
IN + IN -
+
OUTPUT
-
Pin Configurations
Pin 1: Output 1
1 2 3 4 Out
Pin 5 : Non Inverting Input 2 Pin 6 : Inverting Input 2 Pin 7 : Output 2 Pin 8 : Vcc
8 7 Out
Pin 2: Inverting Input 1 Pin 3: Non Inverting Input 1 Pin 4: VEE
+
6 5
+
Schematic Diagram
Vcc
6uA
100uA Q5
6uA Q6 Cc Q7 Rsc Q2 Inverting Input + Non Inverting Input Q8 Q9 Q1 Q3 Q4 Q11 Output Q13 Q10 Q12 50uA
HLM358P, HLM358S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Absolute Maximum Ratings (Ta=25oC, unless otherwise specified)
Symbol VCC VCC, VEE VIDR VICR tSC TJ Tstg TA PD Parameter Power Supply Voltage (Single Supply) Power Supply Voltage (Split Supplies) Input Differential Voltage Range Input Common Mode Voltage Range Output Short Circuit Duration Junction Temperature Storage Temperature Range Operating Ambient Temperature Range Maximum Power Dissipation (DIP-8) Maximum Power Dissipation (SO-8)
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 2/7
Range 32 16 32 -0.3 to +32 Continuous 150 -55 to +125 0 to +70 800 500
Units VDC VDC VDC VDC
o
C
C C mW
Electrical Characteristics (VCC=5V, VEE=Ground, Ta=25oC, unless otherwise specified)
Symbol VIO IIO IIB AVOL CMR CS PSR VIO/T IIO/T VICR VOH VOL ICC ISource ISink ICC ISC Parameter Input Offset Voltage Input Offset Current Input Bias Current Large Signal Voltage Gain Common-Mode Rejection Ratio Channel Separation Power Supply Rejection Average Temperature Coefficient of Input Offset Voltage Average Temperature Coefficient of Input Offset Current Input Common Mode Voltage Range Output Voltage (High Limit) Output Voltage (Low Limit) Supply current Output Source Current Output Sink Current Power Supply Current Output Short Circuit to Ground Test Conditions VCC=5V~30V, VICR=0V~VCC-1.5V, VO=1.4V, RS=0 IIN(+)-IIN(-) IIN(+) or IIN(-) VCC=15V, RL=2K VCM=0V~VCC-1.5V 1KHzf20KHz VCC=5V~30V RS=0 RS=0 VCC=30V VCC=30V, RL=2K VCC=30V, RL=10K RL=10K RL=,VCC=30V VCC=15V, VIN+=1V, VIN-=0V, VO=2V VCC=15V, VIN+=0V, VIN-=1V, VO=2V VCC=30V, Ta=Thigh to Tlow VCC=5V, Ta=Thigh to Tlow VCC=5V, GND at -5V, VO=0V 26 27 20 10 27 28 5 1 40 20 1 0.6 40 HLM358P/S Min 25 65 65 Typ 2 35 100 85 -120 100 7 10 Max 7 30 200 VCC-2V 20 2 2 1.2 60 Unit mV nA nA V/mV dB dB dB uV/oC pA/oC V V mV mA mA mA mA mA mA
HLM358P, HLM358S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Power Supply Current & Power Supply Voltage
1.8
14 12 10 8 6 4 2 0 1 10
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 3/7
Large Signal Frequency Response
Ta=25 C RL= 1.2
o
0.9
VOR, Output Voltage Range (Vpp).. .
ICC, Power Supply Current (mA).. .
1.5
0.6
0.3
RL=2K VCC=15V VEE=GND AV=-100 RI=1K RF=100K
0 0 5 10 15 20 25 30 35
VCC, Power Supply Voltage (V)
100
1000
f, Frequency (KHz)
Large Signal Open Loop Voltage Gain
120 1 8
Voltage Follower Pulse Response
Output Voltage (V) ..
3 7 2 6 1 5 0 4 RL2.0K V+=15VDC
AVOI, Open Loop Voltage Gain (dB) ...
100 VCC=15V VEE=Gnd o Ta=25 C
80
60
Input Voltage (V)..
1 10 100 1000 10000 100000 1000000
40
3 2 1 0
20
0
f, Frequency (Hz)
0
5
10
15
20
25
30
35
40
t, Time (us)
Small Signal Voltage Follower Pulse Response (Non Inverting)
450
Voltage Gain
140 RL=20K 120
VO, Output Voltage (mV)
400
AVOL, Voltage Gain (dB)...
100 RL=2K 80 60 40 20 0
350
300 VCC=30V VEE=Gnd o Ta=25 C CL=50pF
250
200 0 1 2 3 4 5 6 7 8
0
5
10
15
20
25
30
35
t, Time (us)
V+, Supply Voltage (V)
HLM358P, HLM358S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Power Supply Voltage & Input Bias Current
50 45 40 Ta=25 C
o
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 4/7
Input Voltage Range
15
Input Bias Current (nA).. .
35 30 25 20 15 10 5 0 0 5 10 15 20 25 30 35
VIN, Input Voltage (V).. .
Negative 10 Positive
5
0 0 5 10 15
Power Supply Voltage (V)
V+/V-, Power Supply Voltage (V)
Typical Application Circuit
Voltage Follower Non Inverting DC Amplifier
VIN
+ 1/2 HLM358
OUT
1/2 HLM358 VIN +
R1
10K
VO
OUT
VO
-
R2
1M
AV=1+R1/R2
DC Summing Amplifier
Squarewave Oscillator
V1 V2 V3 V4
100K
+
100K 100K
OUT
R1
100K OUT
1/2 HLM358 100K
VO
0.001uF
1/2 HLM358 +
VO
+
100K
100K
VIN R2
100K
-
R1
100K
R4
100K
VO=V1+V2-V3-V4 Where (V1+V2)(V3+V4) To keep VO0V
HLM358P, HLM358S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Typical Application Circuit
Function Generator
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 5/7
Pulse Generator
Vref=1/2VCC
+ Vref 1/2 HLM358 C
Triangle Wave Output
R1
100K
1N914
R3
100K OUT
+ R1
R2
300K
R2
150K
1/2 HLM358 100K
OUT
C
0.001uF
100K
Square Wave Output
1/2 HLM358 +
OUT
VO
+
Rf
Vref
V+ R3
100K
-
R5
100K
R4
100K
F=(R1+RC)/4CRfR1 if R3=R2*R1/(R2+R1)
DC Coupled Low-Pass RC Active Filter
High Input Z, DC Differential Amplifier
R1 VIN
16K
R2
16K
+
C1
0.01uF OUT
R1
100K
-
R2
100K
C2
0.01uF
1/2 HLM358 -
VO R3
100K
R3
100K OUT
1/2 HLM358 V1+ V2+ +
-
R4
100K OUT
1/2 HLM358 +
VO
R4
100K
f0=1KHz, Q=1, AV=2
R1/R2=R4/R3 VO=1+R4/R3(V2-V1) As shown VO=2(V2-V1)
Active Band-Pass Filter
R2 V1+
100K
R1
100K OUT
C1
330pF
1/2 HLM358 +
R5 R4
10M OUT
1/2 HLM358 +
470K
R3
100K
C2
330pF OUT
1/2 HLM358 +
R6
470K
VO R7
100K
R7
1K
VCC
R8
100K
C3
10uF
f0=1KHz, Q=50, AV=100 (40dB)
HLM358P, HLM358S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
DIP-8 Dimension
Marking:
8 7 6 5
Pb Free Mark
Pb-Free: " . " Normal: None
(Note)
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 6/7
DIM A B
H L M3 5 8 P
Min. 6.29 9.22 3.25 3.17 0.38 2.28 7.49 8.56 0.229 94o
Max. 6.40 9.32 *1.52 *1.27 *0.99 3.35 3.55 0.53 2.79 7.74 *3.00 8.81 0.381 97o
A
1 2 3 4
C D
Control Code
Date Code
E F G H I J K L M 1
B
J F
Note: Green label is used for pb-free packing Pin Style: 1.Output 1 2.Inverting input 1 3.Non inverting input 1 4.VEE 5.Non inverting input 2 6.Inverting input 2 7. Output 2 8.VCC
C
E D
G H
1 K
M L
Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
I
8-Lead DIP-8 Plastic Package HSMC Package Code: P
*: Typical, Unit: mm
SO-8 Dimension
A G
Marking:
Pb Free Mark
Pb-Free: " . " (Note) H Normal: None
8 B
7
6
5 C 4 J H
I
S
L M3 5 8 Control Code
Pin 1 Index Date Code
Pin1 Index
2
3
Note: Green label is used for pb-free packing Pin Style: 1.Output 1 2.Inverting input 1 3.Non inverting input 1 4.VEE 5.Non inverting input 2 6.Inverting input 2 7. Output 2 8.VCC Material: * Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
D
E
Part A
K L N O
Part A
M
DIM A B C D E F G H I J K L M N O
Min. 4.85 3.85 5.80 1.22 0.37 3.74 1.45 4.80 0.05 0.30 0.19 0.37 0.23 0.08 0.00
Max. 5.10 3.95 6.20 1.32 0.47 3.88 1.65 5.10 0.20 0.70 0.25 0.52 0.28 0.13 0.15
*: Typical, Unit: mm
F
8-Lead SO-8 Plastic Surface Mounted Package HSMC Package Code: S
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HLM358P, HLM358S
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC's Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%15% 2. Reflow soldering of surface-mount devices Figure 1: Temperature profile
tP TP Ramp-up TL Tsmax Temperature tL
Spec. No. : IC200409 Issued Date : 2004.05.01 Revised Date : 2004.05.14 Page No. : 7/7
Critical Zone TL to TP
Tsmin tS Preheat
Ramp-down
25 t 25oC to Peak Time
Profile Feature Average ramp-up rate (TL to TP) Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (min to max) (ts) Tsmax to TL - Ramp-up Rate Time maintained above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Time within 5oC of actual Peak Temperature (tP) Ramp-down Rate Time 25 C to Peak Temperature 3. Flow (wave) soldering (solder dipping) Products Pb devices. Pb-Free devices.
o
Sn-Pb Eutectic Assembly <3oC/sec 100oC 150oC 60~120 sec <3oC/sec 183oC 60~150 sec 240oC +0/-5oC 10~30 sec <6oC/sec <6 minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 sec <3oC/sec 217oC 60~150 sec 260oC +0/-5oC 20~40 sec <6oC/sec <8 minutes
Peak temperature 245 C 5 C
o o
Dipping time 5sec 1sec 5sec 1sec
260 C +0/-5 C
o
o
HLM358P, HLM358S
HSMC Product Specification


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